3D power management solution
Our 3D power delivery SoC devices have the highest density of system integration in the industry by vertically integrating PWM controller, power switches and magnetics. The SoC structure we have developed in our proprietary technology is a unique stack-up method of magnetic layers, silicon chip layer and I/O layer. The magnetic integration is in a distributed pattern cross the whole layer and the discrete magnetic components are completely eliminated in the power converter. The interconnect between the magnetics and silicon chips, which is through micro-via inside the device, have much lower parasitic than other integration method like discrete-co-packaging. The electromagnetic field is shielded from emitting to outside of the device.
The SoC devices are designed in DC-DC power delivery in multiple topologies including buck, boost, and buck-boost. In the dynamic characteristics, the voltage control loop is particular optimized for the particular inductor integrated inside the device. The dynamic response is substantially better than conventional discrete type of designs that it is difficult in considering value of magnetics, which has large unit-by-unit tolerance.
The package of the devices are developed as industry popular types, such as QFN, LGA or BGA. The devices have multiple conductor layers, as a result, its thermal performance is substantially enhanced. Compared to typical semiconductor packages like QFN type, its thermal conductivity is about 25% better in the same footprint area.
Our devices can significantly save the board area to occupy. The aspect ratio between 3 dimensional x-y-z axes is a trade-off that can be chosen to fit product needs. The device can be designed to be small either in x-y footprint or height. The flexibility shows tremendous advantages in systems of power management and battery management. In low profile systems, for example, Ultrabooks, tablet, smartphones, SSD and so on, the height are in a trend of continuous reduction. However, many industrial systems still want small x-y areas. The typical range of the device height is from 0.6mm to 3.0mm.
The SoC devices are designed in DC-DC power delivery in multiple topologies including buck, boost, and buck-boost. In the dynamic characteristics, the voltage control loop is particular optimized for the particular inductor integrated inside the device. The dynamic response is substantially better than conventional discrete type of designs that it is difficult in considering value of magnetics, which has large unit-by-unit tolerance.
The package of the devices are developed as industry popular types, such as QFN, LGA or BGA. The devices have multiple conductor layers, as a result, its thermal performance is substantially enhanced. Compared to typical semiconductor packages like QFN type, its thermal conductivity is about 25% better in the same footprint area.
Our devices can significantly save the board area to occupy. The aspect ratio between 3 dimensional x-y-z axes is a trade-off that can be chosen to fit product needs. The device can be designed to be small either in x-y footprint or height. The flexibility shows tremendous advantages in systems of power management and battery management. In low profile systems, for example, Ultrabooks, tablet, smartphones, SSD and so on, the height are in a trend of continuous reduction. However, many industrial systems still want small x-y areas. The typical range of the device height is from 0.6mm to 3.0mm.
Inductor network integration
In power management, sensor, MEMS and RF designs, oftentimes, multiple inductors are needed to make inductor networks. By optimizing the magnetic layer property and structure, our inductors can be designed at a high quality (Q) factor. In low noise voltage filtering, the high Q is achieved in a frequency between 2MHz to 20MHz. But in radio frequency systems, the high Q happens in a frequency up to 1GHz. The maximum quality factor is designed as high as 60 to 100 depending on design needs.
Our inductor integration is capable of having 2 or more inductors on a single layer. The technique has accurate inductance match and low resistance shift.
Our inductor integration is capable of having 2 or more inductors on a single layer. The technique has accurate inductance match and low resistance shift.
Isolated power conversion integrations
In isolated power converters, system design needs components in both primary side and secondary side of the power transformer. In the primary side is a PWM controller, a power switch, a snubber filter and startup circuits. The secondary side includes a rectifier diode, output filter capacitor and others. The transformer has to be able to support high breakdown voltage and creepage distance to meet safety agency standard from UL and so on. 10 to 20 discrete components are required to complete a design.
Our 3D isolated power delivery SoC employs a flyback topology to realize the whole voltage conversion in a single device. The breakdown voltage level is from 2.5KV to 5.0KV, depending on the operation voltage level, to meet the safety needs. An isolation layer that has a reliable dielectric capability is put between the primary side and secondary side.
The solution has eliminated about a dozen of discrete components. The production test ensures very good performance repeatability part-to-part. The user can simply choose a single component to replace the conventional design.
Our 3D isolated power delivery SoC employs a flyback topology to realize the whole voltage conversion in a single device. The breakdown voltage level is from 2.5KV to 5.0KV, depending on the operation voltage level, to meet the safety needs. An isolation layer that has a reliable dielectric capability is put between the primary side and secondary side.
The solution has eliminated about a dozen of discrete components. The production test ensures very good performance repeatability part-to-part. The user can simply choose a single component to replace the conventional design.
IoT filter network Integration
In IoT system designs, the RF filter and by-pass filter are the main discrete parts around the RF chip set. Our technology integrates all the filters including Balun filter, low pass filter and by-pass filter. The typical applications systems are WIFI, Bluetooth and Zigbee. The integrated solution has low insertion loss, high thermal stability and low frequency ranging.
The filter integration offers a flexible package in terms of RF interconnect. The main RF chipset which can be either on top of the filter or the bottom side of the filter, is connected to the system board in either BGA or I/O pads. The vertical integration structure reduces the solution area significantly.
The filter integration offers a flexible package in terms of RF interconnect. The main RF chipset which can be either on top of the filter or the bottom side of the filter, is connected to the system board in either BGA or I/O pads. The vertical integration structure reduces the solution area significantly.